Μερικές φωτογραφίες από το εσωτερικό του Mi-2S
①: TOSHIBA THGBM: Toshiba memory chip
②: Elpida BA164B1PM: the Elpida run memory chips (the Xiaolong 600 processor is still POP integration package)
③: Qualcomm PM8921: Qualcomm power management chip
④: Qualcomm MDM8215M: baseband chip, support DC-HSPA + network
⑤: Qualcomm WTR-1605: RF chip
⑥: SIMG 9244B0: Silicon Image Sil9244/MHL HD output chip
⑦: AVAGO ACPM-7051: multi-frequency power amplifier
①: TOSHIBA THGBM: Toshiba memory chip
②: Elpida BA164B1PM: the Elpida run memory chips (the Xiaolong 600 processor is still POP integration package)
③: Qualcomm PM8921: Qualcomm power management chip
④: Qualcomm MDM8215M: baseband chip, support DC-HSPA + network
⑤: Qualcomm WTR-1605: RF chip
⑥: SIMG 9244B0: Silicon Image Sil9244/MHL HD output chip
⑦: AVAGO ACPM-7051: multi-frequency power amplifier